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Two Research positions on advanced technologies for 3d integration of silicon devices

The Micro-Nano characterization & fabrication Facility (MNF) of Fondazione Bruno Kessler supports the research units of the Centre for Materials and Microsystems (CMM) managing laboratories and personnel in two main areas:

   - micro-nanofabrication;

   - materials characterization.

The Microfabrication Area runs two separate cleanrooms: the Detector Cleanroom, mostly dedicated to the development of radiation sensors, and the MEMS cleanroom, where micro devices and sensors for different applications are developed. It also includes a Testing Area for the automatic and manual parametric/functional device testing, and a packaging cleanroom with tools for device bonding, and for the enclosure of the devices in specific housings.

The Materials Characterization Area runs different laboratories for the physical/chemical analysis of materials, surfaces and interfaces, including techniques like scanning electron microscopy (SEM), atomic force microscopy (AFM), secondary ion mass spectrometry (SIMS), x-ray photoelectron spectroscopy (XPS) and others.

More information about MNF is available at


Job description


Starting from late-2020, the MNF cleanrooms will be extended and equipped with new fabrication instrumentation, including new equipment for 3D integration of optical and radiation sensors: Wafer Bonding; Wafer Grinding and Thinning; Chemical-Mechanical Polishing and Tungsten Chemical Vapour Deposition. The new instrumentation is expected to integrate and innovate the FBK facility to fulfil nowadays technology requests of photon and radiation detectors.


In this context, we are looking for two Researchers who will be involved in the development of novel 3D-integrated silicon sensors, which requires a quite wide range of processes including: dry etching, thin film deposition, lithography and wafer bonding. with particular reference to the technologies for both Wafer Bonding and dry etching, the main activities to be carried out will be:


  • Developing of Wafer Bonding/Debonding techniques in MNF cleanroom and running the related equipment:
    • learning the basics of different Bonding Technologies: (temporary bonding/debonding; fusion bonding; direct metal bonding);
    • learning how to operate the new instrumentation, with a possible training period abroad in Europe;
    • bringing the new instrumentation to the status of fully operative, supporting the phase of installation and testing.
    • testing the instruments for the MNF requests, investigating all the offered capabilities, defining operative protocols;
    • operating the wafer bonding complimentary processes (cleaning, adhesive coating, baking), in particular the sample preparation and characterization (SEM imaging and relative image processing);
    • interacting with MNF personnel in order to integrate the novel technologies steps within the other microfabrication processes, and in particular within radiation and optical sensors.
  • Running the Plasma Dry etching equipment:
    • learning the basics of Plasma Etching technology: Reactive Ion Etching (RIE); Inductively Coupled Plasma Etching (ICP-RIE); Deep Reactive Ion Etching (DRIE);
    • developing new dry etching processes and integrate them in device microfabrication processes;
    • operating the dry etching equipment in the MNF cleanroom supporting the colleagues and the cleanroom users.


  • Reporting and dissemination of results:
    • reporting the outcome of tests and fabrication steps to internal or external customers, preparing presentations and written reports;
    • disseminating scientifically relevant results to workshops or conferences.


Main focus of the activities will be the implementation of the research results for the development of new single photon sensors devices (SiPM and SPAD), but other possible devices will also be included to exploit the research advancement as well. Besides these main topics, the selected candidate will be also encouraged to develop research lines exploiting the opportunities provided by the new instrumentation and to learn about microfabrication processes and techniques for the production of SPAD and SiPM, acquiring the capability to correlate specific microfabrication steps to the functional characteristics of the devices.


The ideal candidate should have:


  • Master Degree in Physics, Chemistry, Material Science, Materials Engineering or Electronics Engineering;
  • knowledge of semiconductor microfabrication processes;
  • familiarity with cleanroom fabrication environment and high vacuum tools;
  • good knowledge of English language (oral and written);
  • flexibility;
  • strong teamwork attitude.



Additional knowledges or experiences that will be evaluated:


  • PhD in Physics, Chemistry, Material Science or related fields or equivalent 3-years research experience;
  • experience with Wafer Bonding technologies and complimentary processes;
  • knowledge of TCAD tools for device layout design and for process and device simulations;
  • knowledge of semiconductor device physics and radiation detectors operating principles;
  • scientific publications in the field of semiconductor devices, sensors, photovoltaics;
  • visiting scholarships or experiences at international level.




Type of contract: fixed term contract (full time)

Gross annual salary: from € 34.500 to  € 39.500 (according to competences and experience ot the candidate)

Start date: preferably June 2020 (due to the emergency situation Covid-19 the opportunity to start the activity remotely will be considered)

Duration: 36 months. The contract may be extended where it is consistent with the Foundation’s policies

Workplace: Trento – Povo

Benefits: flexi-time, company subsidized cafeteria or meal vouchers, internal car park, welcome office support for visa formalities, accommodation, social security, public transportation, sport, language courses fees. More info at




Candidates are required to submit their application by clicking on "Apply online" at the bottom of this page.
Please make sure to enclose the following documents with your application (pdf format):

  • Detailed CV
  • Letter of motivation
  • A list of scientific publications


Application Deadline: 10th April, 2020







Please read our Regulations on the recruitment and selection of fixed-term personnel (effective from October 15, 2018) before completing your application. 


For further information, please contact the Human Resources Services at

Business units
Science and Technology Hub - Trento